The ADT-900 XP2 dual-axis X-RAY drilling system from Abletek Inc. is a high-precision device specifically designed for drilling and targeting in printed circuit board (PCB) manufacturing.

Precision and Automatic Calibration:

· The synchronization and surface compensation accuracy of the X and Y axes are less than ±20 microns, ensuring precise and repeated drilling accuracy.

· The target center drilling accuracy is less than ±10 microns.

· The X-ray tube and camera use a coaxial moving mechanism, enhancing the stability of the drilling target.

· The new generation of X-ray cameras has higher stability and longer service life, with a drift range of only 0.1 pixel.

· The system is equipped with self-calibration functionality to ensure drilling target accuracy in mass production.

System Stability:

· Mature assembly technology and high-quality components that require no special adjustment during installation.

· The drilling shaft uses self-lubricating bearings, extending the life of the drill bit.

· Built-in X-ray leakage protection and isolation design prevent external X-ray leakage.

· The system utilizes a large heavy-duty cast iron base, which increases the machine’s operational stability.

High Capacity:

· Industry’s largest field of view X-ray camera for easier board placement and operation.

· Manual and automatic modes for target learning and drilling functions.

· Working data and settings (such as X-ray voltage, current, imaging, drilling speed, etc.) can be stored and accessed with the part number.

· Drilling speed and lift rate can be programmed and set.

Intelligent Optimization Software:

· Built-in automatic image contrast and averaging functions.

· Built-in automatic correction software for X-ray camera plane errors.

· Software for automatic calculation of optimized surface compensation values and CAM design coordinate virtual rotation surface measurement.

· Multiple drilling modes, such as linear compensation, 3-point or 4-point plane compensation, and N/C drilling.

· Non-standard drilling modes can be customized based on customer design needs.

· Complete SPC reporting and drilling classification functions.

Industry 4.0 Smart Manufacturing:

· The system can be integrated with upstream and downstream devices as well as robotic arms to enable unmanned operation according to customer needs.

· The system can be adjusted to meet smart manufacturing requirements, uploading production parameters and equipment action data to the customer’s MES system.

Technical Specifications:

· Total copper thickness: 0.3 ~ 16 ounces.

· Board thickness: Minimum ≧ 0.1 mm (including copper).

· Inner layer copper thickness: 12 microns ~ 105 microns.

· PCB warpage: < 5 mm.

· CCD image acquisition: ± 20 mm range with no similar targets or circular markers.

· Drilling diameter: 3.175 ~ 5.0 mm (maximum) (drill bit diameter is 3.175 mm).

· Standard working panel size: Board X/Y: 780 × 670 mm (maximum), Board X/Y: 310 × 210 mm (minimum).

· Standard drilling target distance: X-axis distance: 300 ~ 740 mm, Y-axis distance: 0 ~ 600 mm.

· Standard working panel thickness: 0.3 ~ 8.0 mm, thinner than 0.3 mm (to be discussed).